Infill Density Effects on the Mechanical and Thermal Properties of Copper‐Plated 3D Printed Parts

Abstract Fused Filament Fabrication (FFF) is a 3D‐printing technique that enables the production of complex geometries with high level customization at low cost. The poor mechanical properties FFF‐printed parts often undermine application this technology for structural purposes. To overcome limitation, two‐step metallization method performed to deposit copper layer on exterior an Acrylonitrile–Butadiene–Styrene (ABS) substrate, using non‐toxic and cost‐effective plating solution. Electroplating over exposed grid infill, various densities, exploited improve load transfer between ABS. resulting samples are characterized mechanically thermally, finite element modeling simulations used better understand characterization results. It found infill 50–60% provides best compromise performance thermal conductivity because density enough allow penetration into material create strong interlocking ABS, yet multiple conductive bridges through thickness sample. This study demonstrates effectiveness electroplating as post‐processing simultaneously enhance insights optimal design parameters achieving goal.